Worldwide / domestic Internship

Inquiries/applications

class_program[at]ecsvc.ed.kyushu-u.ac.jp
Please replace [at] with＠.

• Please include [Intern] [name of country you wish to participate in] in the subject line.
• Please write your full name in the text.
• Please write your student ID number in the text.

• 2026/6/4 【Eligibility Requirements Relaxed】2026 Information on the Internship Program at CMSC, Inc. (益芯科SSB inc) “Program”.※The deadline has passed but you can still apply
  
• 2026/5/18 Information on the 2026 TSMC Summer Internship Program. Entrysheet, Flyer. 【Application deadline】 May 31th (Sun)
• 2026/4/1 2026 Information on the Internship Program at CMSC, Inc. (益芯科SSB inc) “About the internship”, “Recruitment requirements”.
  【Application period】Short-term, long-term: April 1st to April 30th (MC), and Long-term: May 1st to May 30th (DC) 2026
• 2026/2/3 （Deadline 3/20）2026 National Cheng Kung University(NCKU) AISSM Semiconductor Summer School We are accepting applications for up to four nominated students. Nominated students can participate at a special rate as students from partner universities. Those who are interested should contact us by email at the address above. 　https://2026sss.ais2m.ncku.edu.tw/ , Program Flyer , Program Brochure
• 2026/1/16 AI+X tracks, industry-aligned externship projects, and optional MIT on-campus experience. Online Information and Brochure.
• 2025/6/16 (Deadline: June 30th (MC), and July 30rh (DC) 2025) CMSC, Inc. (益芯科SSB inc) Internship. “About the internship”, “Flyer”.
• 2025/4/8 (Deadline May 15th) National Chung Hsing University, Taichung, Taiwan Semiconductor summer school:If you would like to participate, below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
  please submit, and contact us with Subject (NCHU Summer school) at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2025/3/26 (Deadline May 1st) National Taiwan University EECS Global Elite Cultivation Fellowship:If you would like to participate, please contact us with Subject (NTU Fellowship) at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2024/12/12 (Deadline extended to December 31st). NTU Taiwan Chip-based Industrial Innovation Program: If you would like to participate, please contact us at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2024/5/14 〈Netherlands〉EINDHOVEN SEMICONDUCTOR SUMMER SCHOOL (Travel and accommodation expenses are required.）
  If you would like to join, please send an email to the above. (deadline: 5/23)
• 2024/4/17 Kyushu U-TSMC MOU Ver3
• 2024/4/15 Student Mobility Programs
• 2024/4/15 2024 TSMC summer internship flyer
• 2024/4/15 United states, UPWARDS internship program
• 2024/4/15 Introduction to semiconductor-related overseas internships sponsored by the Department of EESC and ISEE