Worldwide / domestic Internship

Inquiries/applications

class_program[at]ecsvc.ed.kyushu-u.ac.jp
Please replace [at] with＠.

• Please include [Intern] [name of country you wish to participate in] in the subject line.
• Please write your full name in the text.
• Please write your student ID number in the text.

• 2025/4/8(Deadline May 15th) National Chung Hsing University, Taichung, Taiwan Semiconductor summer school:If you would like to participate, below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
  please submit, and contact us with Subject (NCHU Summer school) at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2025/3/26 (Deadline May 1st) National Taiwan University EECS Global Elite Cultivation Fellowship:If you would like to participate, please contact us with Subject (NTU Fellowship) at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2024/12/12  (Deadline extended to December 31st). NTU Taiwan Chip-based Industrial Innovation Program: If you would like to participate, please contact us at the email address below. class_program[at]ecsvc.ed.kyushu-u.ac.jp
• 2024/5/14 〈Netherlands〉EINDHOVEN SEMICONDUCTOR SUMMER SCHOOL (Travel and accommodation expenses are required.）
  If you would like to join, please send an email to the above. (deadline: 5/23)
• 2024/4/17 Kyushu U-TSMC MOU Ver3
• 2024/4/15 Student Mobility Programs
• 2024/4/15 2024 TSMC summer internship flyer
• 2024/4/15 United states, UPWARDS internship program
• 2024/4/15 Introduction to semiconductor-related overseas internships sponsored by the Department of EESC and ISEE